Part number: XCV100E-6FGG256C
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XCV100E-6FGG256C Component Specifications
General Information: The XCV100E-6FGG256C is a cutting-edge component renowned for its advanced capabilities and versatile applications in the field of electronic engineering. This component is engineered to deliver exceptional performance, reliability, and efficiency in a wide range of electronic systems.
Specifications
- Technology: Utilizes state-of-the-art FPGA technology to provide flexible and programmable functionality for diverse electronic applications.
- Package: Housed in a compact and robust 256-ball Fine Pitch Ball Grid Array (FBGA) package for efficient thermal management and space-saving integration.
- Speed: Offers high-speed processing capabilities, enabling rapid data processing and seamless operation in demanding electronic systems.
- Configuration: Features a generous logic cell capacity and versatile I/O options for adaptable configuration based on specific project requirements.
Applications
- Telecommunications: Ideal for telecommunications infrastructure, networking equipment, and data communication systems requiring high-speed data processing and reliable performance.
- Embedded Systems: Well-suited for embedded applications in industrial control, automotive electronics, and IoT devices where programmability and flexibility are essential.
- Consumer Electronics: Used in consumer electronics products such as smart TVs, gaming consoles, and digital appliances to enhance functionality and performance.
Compliance
Industry Standards: The XCV100E-6FGG256C complies with industry regulations and quality standards, ensuring adherence to best practices and performance benchmarks for electronic components.
Identification
The designation XCV100E-6FGG256C provides detailed insights into the component's specifications, capabilities, and compatibility, facilitating accurate selection and integration into electronic designs and systems.
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