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Part number: XC4VLX40-11FFG1146C

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XC4VLX40-11FFG1146C Component Specifications

General Information: The XC4VLX40-11FFG1146C is a high-performance FPGA (Field-Programmable Gate Array) component renowned for its versatility and reliability in advanced electronic systems. This component offers exceptional programmability and processing capabilities, making it a preferred choice for applications requiring complex logic functions and rapid prototyping.

Specifications

  • Architecture: Utilizes advanced FPGA architecture with a high logic density and configurable resources, enabling efficient implementation of diverse algorithms and designs.
  • Speed Grade: Operating at Speed Grade 11, this FPGA delivers fast processing and response times, crucial for real-time applications and high-speed data processing.
  • Package: Housed in a FFG1146C package, this component offers a balance of compact size and thermal performance, suitable for various system layouts and cooling requirements.
  • Features: Equipped with numerous I/O ports, embedded memory blocks, and DSP slices, enhancing its capabilities in signal processing, data manipulation, and interface connectivity.

Applications

  • Telecommunications: Widely used in telecommunications infrastructure for signal processing, protocol handling, and network optimization tasks.
  • Embedded Systems: Ideal for embedded applications requiring customizable logic functions, such as industrial control systems, IoT devices, and automotive electronics.
  • High-Performance Computing: Employed in high-performance computing clusters, supercomputers, and data centers for parallel processing and algorithm acceleration.

Compliance

Industry Standards: The XC4VLX40-11FFG1146C complies with industry standards for FPGA components, ensuring compatibility, reliability, and performance consistency across different applications and environments.

Identification

The designation XC4VLX40-11FFG1146C provides detailed information about the FPGA's configuration, performance characteristics, and packaging details, facilitating accurate integration and utilization in complex electronic designs and systems.

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