Part number: XC3S50AN-4FTG256I
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XC3S50AN-4FTG256I Component Specifications
General Information: The XC3S50AN-4FTG256I is a specialized integrated circuit component renowned for its high-performance capabilities in electronic systems. This component is designed to deliver exceptional functionality and reliability in demanding applications where precision and efficiency are critical.
Specifications
- Technology: Utilizes advanced semiconductor technology to enable fast processing speeds, efficient power management, and reliable operation in complex electronic systems.
- Configuration: Features a specific configuration with 50,000 system gates, ensuring versatility and scalability for various digital designs and applications.
- Package: Housed in a 256-pin Fine-pitch Ball Grid Array (FBGA) package, providing compact size and optimal thermal performance for enhanced reliability.
- Operating Conditions: Designed to function within specified temperature and voltage ranges, offering stable performance across varying environmental conditions.
Applications
- Embedded Systems: Ideal for use in embedded systems, IoT devices, and industrial automation where high-speed processing and programmable logic are required.
- Telecommunications: Commonly integrated into telecommunications equipment for data processing, signal routing, and network management applications.
- Consumer Electronics: Used in consumer electronics such as smart devices, gaming consoles, and multimedia systems to enable advanced functionality and connectivity.
Compliance
Industry Standards: The XC3S50AN-4FTG256I complies with industry standards for quality, reliability, and performance, ensuring compatibility with existing systems and adherence to regulatory requirements.
Identification
The code XC3S50AN-4FTG256I denotes specific details about the integrated circuit, including its capacity, package type, and operational characteristics, facilitating accurate identification and integration into electronic designs and manufacturing processes.
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