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Part number: XC3S250E4TQ144C

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XC3S250E4TQ144C Component Specifications

General Information: The XC3S250E4TQ144C is a high-performance FPGA (Field-Programmable Gate Array) component known for its versatility and efficiency in electronic design applications. This advanced component offers programmable logic capabilities, making it a preferred choice for a wide range of digital systems requiring flexibility and rapid prototyping.

Specifications

  • Architecture: Utilizes a sophisticated programmable logic architecture that enables users to configure the device for specific functions, allowing for customization and adaptability in various applications.
  • Capacity: Offers ample logic capacity and resources, suitable for implementing complex digital circuits, signal processing algorithms, and embedded systems designs.
  • Speed: Features high-speed operation and efficient signal processing capabilities, ensuring rapid data processing and reliable performance in demanding applications.
  • Package: Housed in a compact and robust QFP (Quad Flat Package) form factor, facilitating easy integration into circuit boards and electronic assemblies.

Applications

  • Embedded Systems: Commonly used in embedded system designs, IoT (Internet of Things) devices, and industrial automation applications for its reconfigurable logic and processing power.
  • Digital Signal Processing: Ideal for implementing digital signal processing algorithms, filters, and data processing tasks in communication systems and audio/video applications.
  • Prototyping: Valued for prototyping new electronic designs, testing algorithms, and developing proof-of-concept systems due to its flexible and reprogrammable nature.

Compliance

Industry Standards: The XC3S250E4TQ144C complies with industry standards for programmable logic devices, ensuring reliability, performance, and interoperability with other components in electronic systems.

Identification

The designation XC3S250E4TQ144C contains key information about the FPGA, including its logic capacity, package type, and operational characteristics, enabling precise identification and utilization in electronic design projects.

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