Part number: XC3090APG175I
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XC3090APG175I Component Specifications
General Information: The XC3090APG175I is a specialized component known for its high-performance capabilities in electronic and digital systems. This component is designed with precision engineering and reliability to meet the demands of advanced technological applications.
Specifications
- Material: Crafted from high-quality materials like silicon and other semiconductor elements to ensure optimal functionality and durability.
- Package: Housed in a 175-pin grid array package, providing a compact and efficient form factor for integration into electronic circuits.
- Speed: Operating at high speeds to support rapid data processing and communication within digital systems.
- Integration: Designed for seamless integration into complex electronic designs, offering versatility and compatibility with various configurations.
Applications
- Digital Systems: Ideal for use in digital signal processing, telecommunications equipment, and data storage devices requiring high-speed and reliable performance.
- Embedded Systems: Commonly integrated into embedded systems for automation, control, and monitoring applications in industrial and commercial settings.
- Telecommunications: Used in telecommunications infrastructure for networking, routing, and switching functions to support efficient data transmission.
Compliance
Industry Standards: The XC3090APG175I component complies with industry standards for electronic components, ensuring quality, reliability, and compatibility with established protocols.
Identification
The code XC3090APG175I provides specific details about the component's package type, pin configuration, and performance characteristics, enabling accurate identification and integration into electronic systems requiring high-speed processing and data handling capabilities.
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