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Part number: XC2VP70-5FFG1704C

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XC2VP70-5FFG1704C Component Specifications

General Information: The XC2VP70-5FFG1704C is a high-performance programmable logic device (PLD) designed for demanding applications in the field of electronics and digital systems. Renowned for its advanced features and reliability, this component offers exceptional functionality and versatility in complex circuit designs.

Specifications

  • Technology: Utilizes cutting-edge FPGA technology to provide reconfigurable logic elements, embedded memory blocks, and high-speed connectivity options for versatile system integration.
  • Speed Grade: Operating at a speed grade of 5, the XC2VP70-5FFG1704C delivers rapid processing capabilities suitable for real-time applications and high-speed data processing requirements.
  • Package: Housed in a 1704-pin Fine-Pitch Ball Grid Array (FFG) package, this component offers compact size and efficient thermal management for optimal performance.
  • Configuration: Features a generous logic capacity and flexible configuration options, enabling designers to implement complex algorithms and logic functions with ease.

Applications

  • Telecommunications: Ideal for telecommunications infrastructure, networking equipment, and data processing systems requiring high-speed data handling and signal processing capabilities.
  • Embedded Systems: Well-suited for embedded applications in automotive electronics, industrial control systems, and aerospace technology where reliability and performance are critical.
  • Signal Processing: Used in digital signal processing (DSP) applications, image processing systems, and audio/video processing equipment for efficient data manipulation and analysis.

Compliance

Industry Standards: The XC2VP70-5FFG1704C complies with industry standards for programmable logic devices, ensuring compatibility, reliability, and performance consistency across diverse applications.

Identification

The designation XC2VP70-5FFG1704C signifies key attributes of the component, including its capacity, speed grade, and package type, facilitating accurate identification and integration into complex electronic designs.

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