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Part number: XC2V3000-5FFG1152C

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XC2V3000-5FFG1152C Component Specifications

General Information: The XC2V3000-5FFG1152C is a high-performance Field-Programmable Gate Array (FPGA) component known for its advanced capabilities and versatility in electronic design applications. This component offers a balance of speed, power efficiency, and programmability, making it suitable for a wide range of complex digital systems.

Specifications

  • Architecture: Utilizes a sophisticated FPGA architecture with advanced logic elements, memory blocks, and routing resources to enable complex digital circuit implementation and customization.
  • Speed Grade: Operates at a speed grade of 5, providing fast processing capabilities for real-time applications and high-speed data processing requirements.
  • Package: Housed in a 1152-pin Fine-Pitch Ball Grid Array (FFG) package, ensuring secure mounting and reliable connections for seamless integration into electronic systems.
  • Configuration: Supports in-system programmability, allowing users to dynamically configure the FPGA to adapt to changing operational needs and optimize performance.

Applications

  • Telecommunications: Commonly used in telecommunications infrastructure for signal processing, data routing, and protocol handling in networking equipment.
  • Embedded Systems: Ideal for embedded system design in industrial automation, automotive electronics, aerospace applications, and other fields requiring customizable hardware acceleration.
  • Signal Processing: Well-suited for digital signal processing tasks such as image and video processing, audio processing, and sensor data analysis due to its parallel processing capabilities.

Compliance

Industry Standards: The XC2V3000-5FFG1152C complies with industry standards for FPGA components, ensuring compatibility, reliability, and performance consistency across different design environments and applications.

Identification

The designation XC2V3000-5FFG1152C signifies key attributes of the FPGA, including its capacity, speed grade, package type, and configurability, facilitating precise identification and integration into electronic designs for optimized functionality.

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