Part number: XC2V1500FG676AGT4I
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XC2V1500FG676AGT4I Component Specifications
General Information: The XC2V1500FG676AGT4I is a high-performance FPGA (Field-Programmable Gate Array) component designed for demanding applications in the electronics and technology sectors. Renowned for its advanced functionality and versatility, this FPGA offers exceptional processing power and configurability for complex systems.
Specifications
- Architecture: Utilizes a sophisticated architecture with a large number of configurable logic blocks, memory elements, and high-speed interconnects, enabling rapid prototyping and implementation of custom digital circuits.
- Configuration: Supports reprogramming of logic functions and interconnections on-the-fly, allowing for dynamic adjustments and optimizations based on application requirements.
- Performance: Delivers high-speed data processing, low latency, and efficient resource utilization, making it suitable for real-time signal processing, communications, and other compute-intensive tasks.
- Package: Housed in a 676-pin Fine-Pitch Ball Grid Array (FG676) package, providing a compact form factor while offering a high pin count for connectivity and integration.
Applications
- Telecommunications: Used in networking equipment, base stations, and communication systems for signal processing, encryption, and protocol handling.
- Embedded Systems: Integrated into embedded devices, IoT (Internet of Things) applications, and industrial control systems for custom logic implementation and rapid development cycles.
- High-Performance Computing: Deployed in supercomputing clusters, data centers, and scientific research facilities for parallel processing, algorithm acceleration, and simulation tasks.
Compliance
Industry Standards: The XC2V1500FG676AGT4I FPGA complies with industry regulations and quality standards, ensuring reliability, performance, and interoperability with other system components.
Identification
The code XC2V1500FG676AGT4I denotes specific features and characteristics of the FPGA, including its capacity, package type, and performance attributes, facilitating accurate identification and integration into complex electronic designs.
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