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Part number: XC2V15005BG575C

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XC2V15005BG575C Component Specifications

General Information: The XC2V15005BG575C is a high-performance FPGA (Field Programmable Gate Array) component known for its advanced capabilities and versatility in electronic design applications. This component offers exceptional programmability and processing power, making it a preferred choice for complex digital systems and signal processing tasks.

Specifications

  • Architecture: Utilizes a sophisticated architecture with a large number of configurable logic blocks, memory resources, and digital signal processing (DSP) slices for efficient implementation of diverse algorithms and functions.
  • Performance: Delivers high-speed processing and low-latency operation, enabling rapid execution of complex tasks and real-time applications.
  • Integration: Supports seamless integration with various peripherals, interfaces, and external components, enhancing system connectivity and functionality.
  • Package: Housed in a compact and rugged package, the XC2V15005BG575C is designed for reliability and ease of integration into electronic systems.

Applications

  • Communications: Ideal for telecommunications equipment, network infrastructure, and data processing systems requiring high-speed data handling and signal processing capabilities.
  • Embedded Systems: Used in embedded applications such as industrial control, automotive electronics, and aerospace systems for implementing complex control algorithms and signal processing tasks.
  • Computing: Suitable for high-performance computing tasks, including scientific simulations, image processing, and artificial intelligence applications that demand accelerated processing power.

Compliance

Industry Standards: The XC2V15005BG575C complies with industry standards for FPGA components, ensuring reliability, performance, and compatibility with existing design practices and tools.

Identification

The designation XC2V15005BG575C signifies specific details about the FPGA, including its capacity, speed grade, and packaging information, facilitating accurate identification and utilization in electronic design projects.

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