Part number: XC2S200EFG456AF
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XC2S200EFG456AF Component Specifications
General Information: The XC2S200EFG456AF is a highly advanced programmable logic device (PLD) designed to offer exceptional performance and versatility in electronic systems. Renowned for its cutting-edge technology and reliability, this component is a top choice for demanding applications requiring rapid processing and flexibility.
Specifications
- Technology: Utilizes advanced FPGA technology to provide reconfigurable logic functions, enabling rapid prototyping and customization for diverse applications.
- Package: Housed in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package, ensuring secure connections and efficient heat dissipation for optimal performance.
- Speed: Operates at high speeds to deliver quick response times and efficient data processing, making it suitable for time-critical tasks.
- Capacity: Offers a generous logic cell capacity and memory resources to accommodate complex designs and algorithms, enhancing system scalability.
Applications
- Telecommunications: Widely used in telecommunications infrastructure for signal processing, data routing, and network management applications.
- Embedded Systems: Ideal for embedded control systems in automotive, aerospace, and industrial automation sectors, providing real-time processing capabilities.
- Consumer Electronics: Employed in consumer electronic devices for multimedia processing, display control, and connectivity features.
Compliance
Industry Standards: The XC2S200EFG456AF complies with industry standards for programmable logic devices, ensuring compatibility, reliability, and performance consistency across various applications.
Identification
The designation XC2S200EFG456AF signifies key characteristics of the PLD, including its capacity, package type, and operational capabilities, facilitating easy identification and integration into complex electronic systems.
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