Part number: SN60/PB40
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SN60/PB40 Solder Alloy Specifications
General Information: The SN60/PB40 solder alloy is a commonly used combination in electronics and electrical applications. Known for its specific composition of 60% tin and 40% lead, this solder alloy offers a balance of properties suitable for various soldering tasks.
Specifications
- Composition: Consists of 60% tin (Sn) and 40% lead (Pb), providing a eutectic mixture with a low melting point and good wetting properties.
- Melting Point: The eutectic composition results in a specific melting point, typically around 183�C, ensuring efficient soldering without excessive heat exposure.
- Fluidity: Exhibits good fluidity when molten, enabling the solder to flow easily and create reliable electrical connections.
- Bonding: Forms strong and durable bonds with a variety of metals commonly used in electronic assemblies.
Applications
- Electronics: Widely used in electronics manufacturing for soldering components on circuit boards, wires, and electrical connections.
- Repair Work: Suitable for repair and rework tasks in electronic devices, providing a reliable and easy-to-use soldering solution.
- Plumbing: In some applications, SN60/PB40 may be used for plumbing tasks where lead-based solders are permitted by regulations.
Compliance
Regulatory Compliance: The SN60/PB40 solder alloy may be subject to specific regulations regarding the use of lead in soldering applications. Users should ensure compliance with relevant directives and guidelines.
Identification
The SN60/PB40 designation indicates the specific composition of the solder alloy, highlighting its tin-lead ratio and properties, aiding in proper selection and application in soldering processes.
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