Part number: L1A6784-FSBGA
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L1A6784-FSBGA Component Specifications
General Information: The L1A6784-FSBGA is a specialized component designed for high-density electronic applications where space efficiency and performance are critical. This component is engineered with precision and reliability to meet the demands of advanced electronic systems.
Specifications
- Material: Manufactured using high-quality materials such as semiconductor-grade silicon or advanced polymers to ensure optimal electrical performance and reliability.
- Package Type: Utilizes a Flip-Chip Fine-Pitch Ball Grid Array (FSBGA) packaging, enabling high pin count and compact footprint suitable for miniaturized electronic devices.
- Integration: Designed for seamless integration into complex electronic circuits, offering high-speed signal processing and efficient thermal management.
- Operating Conditions: Engineered to operate within specific temperature and voltage ranges, ensuring stable performance under varying environmental conditions.
Applications
- Telecommunications: Ideal for use in telecommunications equipment, routers, and networking devices requiring high-speed data processing and compact form factors.
- Consumer Electronics: Suited for compact consumer electronic devices such as smartphones, tablets, and wearables, where space optimization is essential.
- Computing Systems: Commonly integrated into servers, data centers, and computing systems demanding high computational power and reliability.
Compliance
Industry Standards: The L1A6784-FSBGA component complies with industry standards for electrical performance, thermal management, and reliability, ensuring compatibility with various electronic systems.
Identification
The designation L1A6784-FSBGA provides essential information about the component's packaging type, material composition, and intended applications, facilitating accurate selection and integration into electronic designs.
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