Part number: D532KHZN/BGA
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D532KHZN/BGA Part Specifications
General Information: The D532KHZN/BGA part is a specialized component known for its high-performance capabilities in electronic and semiconductor applications. This part is meticulously designed to meet stringent industry standards and provide reliable functionality in demanding operational environments.
Specifications
- Material: Crafted from high-quality materials like silicon, copper, and various alloys to ensure superior conductivity, heat dissipation, and overall performance.
- Compatibility: Engineered to be compatible with specific electronic systems and circuit designs, offering seamless integration and optimal functionality.
- Package Type: Utilizes a Ball Grid Array (BGA) packaging, which enhances thermal performance, electrical conductivity, and space efficiency in electronic assemblies.
- Operating Conditions: Designed to operate within defined temperature, voltage, and frequency ranges to maintain stability and reliability under varying conditions.
Applications
- Electronic Devices: Commonly used in advanced electronic devices such as computers, mobile phones, and networking equipment to facilitate data processing and communication functions.
- Semiconductor Industry: Integral component in semiconductor manufacturing processes for memory modules, processors, and other semiconductor devices.
- Telecommunications: Employed in telecommunications infrastructure for signal processing, data transmission, and network connectivity applications.
Compliance
Industry Standards: The D532KHZN/BGA part complies with industry-specific standards and regulations, ensuring reliability, safety, and performance consistency in electronic and semiconductor systems.
Identification
The code D532KHZN/BGA contains essential information about the part's specifications, packaging type, and intended applications, enabling accurate identification and integration into electronic designs and manufacturing processes.
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