Part number: D0829CCBGA
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D0829CCBGA Component Specifications
General Information: The D0829CCBGA is a sophisticated integrated circuit package designed for advanced electronic applications. Renowned for its compact design and high performance, this component is a key element in cutting-edge electronic systems requiring precision and reliability.
Specifications
- Material: Crafted from high-quality materials such as ceramic or specialized polymers to ensure excellent electrical insulation and thermal management.
- Package Type: Features a Chip Ball Grid Array (CBGA) configuration, offering a high pin count and compact footprint for efficient board space utilization.
- Functionality: Engineered to support complex electronic functions, including signal processing, data storage, and communication protocols, for diverse applications.
- Thermal Management: Incorporates advanced heat dissipation techniques to maintain optimal operating temperatures and enhance overall reliability.
Applications
- Telecommunications: Commonly used in networking equipment, routers, and communication devices for seamless data transmission and processing.
- Computer Systems: Integral component in high-performance computers, servers, and data centers to facilitate efficient computing operations.
- Consumer Electronics: Found in smartphones, tablets, and multimedia devices to enable diverse functionalities and enhance user experience.
Compliance
Industry Standards: The D0829CCBGA complies with industry standards for integrated circuit packages, ensuring compatibility, reliability, and performance in accordance with established norms.
Identification
The designation D0829CCBGA specifies key attributes of the component, aiding in its identification, integration, and utilization within electronic systems requiring advanced processing capabilities and compact form factors.
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