Part #: 731E-PBGA
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731E-PBGA Component Specifications
General Information: The 731E-PBGA is a sophisticated component widely used in electronic and semiconductor applications. Renowned for its advanced design and reliability, this component is integral to high-performance systems requiring precision and efficiency.
Specifications
- Material: Crafted from high-quality materials like silicon, ceramic, or specialized alloys to ensure optimal electrical performance and thermal management.
- Package Type: Utilizes a Plastic Ball Grid Array (PBGA) packaging, offering enhanced thermal dissipation and electrical connectivity for complex integrated circuits.
- Pin Count: Features a specific number of pins arranged in a grid pattern to facilitate secure connections and efficient signal transmission.
- Technology: Incorporates advanced semiconductor technologies such as flip-chip bonding or wire bonding for reliable interconnections and improved electrical characteristics.
Applications
- Electronic Devices: Essential for high-speed digital applications, microprocessors, memory modules, and other electronic devices requiring compact and high-performance components.
- Telecommunications: Used in networking equipment, routers, and communication devices to enable fast data processing and reliable connectivity.
- Computing Systems: Integral to servers, graphic cards, and computing systems demanding efficient data processing and high-speed performance.
Compliance
Industry Standards: The 731E-PBGA component complies with industry standards for semiconductor devices, ensuring adherence to quality, reliability, and performance benchmarks for electronic applications.
Identification
The designation 731E-PBGA signifies specific information about the component's packaging, pin configuration, and technology, aiding in accurate identification and seamless integration into electronic circuitry and systems.
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