Part #: 44-SOIC/525MIL
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44-SOIC/525MIL Component Specifications
General Information: The 44-SOIC/525MIL component is a specialized integrated circuit package designed for use in electronic applications requiring compact and efficient circuitry. Renowned for its high-density design and reliable performance, this component is favored for its versatility and suitability for various electronic systems.
Specifications
- Package Type: The 44-SOIC/525MIL package features a Small Outline Integrated Circuit (SOIC) design with 44 pins spaced at a pitch of 525 mils (thousandths of an inch), ensuring compatibility with standard PCB layouts.
- Material: Constructed from high-quality materials to provide excellent electrical insulation, thermal conductivity, and mechanical strength for optimal performance.
- Dimensions: Compact dimensions make it ideal for applications with space constraints while maintaining reliable electrical connections.
- Operating Conditions: Designed to operate within specified temperature and voltage ranges to ensure stability and longevity in electronic circuits.
Applications
- Electronic Devices: Commonly used in consumer electronics, telecommunications equipment, and industrial control systems for signal processing and control functions.
- Computing Systems: Suitable for use in computers, servers, and networking devices where space-efficient and high-performance integrated circuits are required.
- Automotive Electronics: Utilized in automotive applications such as engine control units, infotainment systems, and safety modules for reliable performance in harsh environments.
Compliance
Industry Standards: The 44-SOIC/525MIL component complies with industry standards for integrated circuit packages, ensuring compatibility, reliability, and performance consistency in electronic assemblies.
Identification
The designation 44-SOIC/525MIL provides key information about the component's package type, pin count, and pitch, facilitating accurate identification and integration into electronic designs and manufacturing processes.
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