Part #: 28-DIP
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28-DIP Component Specifications
General Information: The 28-DIP component is a versatile and widely used integrated circuit package format designed for various electronic applications. Known for its ease of use and compatibility with standard socket designs, the 28-DIP package offers a convenient solution for housing integrated circuits.
Specifications
- Material: Typically made from heat-resistant and electrically insulating materials to ensure component integrity and reliability.
- Dimensions: Standardized dimensions for compatibility with industry-standard socket designs, facilitating easy integration into electronic systems.
- Configuration: Features 28 dual in-line pins arranged in two parallel rows, allowing for secure connections and efficient signal transmission.
- Compatibility: Designed to accommodate a wide range of integrated circuits, including microcontrollers, memory chips, and other electronic components.
Applications
- Electronic Devices: Commonly used in consumer electronics, industrial control systems, telecommunications equipment, and other electronic devices requiring integrated circuit packaging.
- Prototyping: Ideal for prototyping and testing electronic circuits due to its ease of use and compatibility with breadboards and development platforms.
- Education: Widely utilized in educational settings for teaching electronics and integrated circuit design principles.
Compliance
Industry Standards: The 28-DIP package complies with industry standards for integrated circuit packaging, ensuring compatibility and reliability in electronic applications.
Identification
The designation 28-DIP signifies the specific package format and pin configuration of the component, aiding in easy identification and selection for electronic design and manufacturing processes.
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