Part #: 1X1X.005CPLANESUBSTRATES
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1X1X.005CPLANESUBSTRATES Component Specifications
General Information: The 1X1X.005CPLANESUBSTRATES component is a specialized substrate designed for use in electronic, semiconductor, and microelectronic applications. This substrate is known for its precision manufacturing and reliability in demanding technological environments.
Specifications
- Material: Typically made from high-quality materials such as silicon, glass, or specialized ceramics to provide excellent thermal and electrical properties.
- Dimensions: Engineered with precise measurements to ensure compatibility with microelectronic components and semiconductor devices.
- Thickness: Features an ultra-thin profile of 0.005 inches (0.127 mm), ideal for applications requiring minimal thickness for compact designs.
- Flatness: Maintains a high degree of flatness to support the accurate placement and bonding of electronic components on the substrate surface.
Applications
- Electronic Manufacturing: Essential for creating integrated circuits, sensors, and microelectronic devices in the semiconductor industry.
- Sensor Technology: Used in sensor arrays, MEMS (Micro-Electro-Mechanical Systems), and other sensor-based applications requiring precision and reliability.
- Optoelectronics: Supports the development of optoelectronic devices such as LEDs, photodetectors, and optical sensors for various technological applications.
Compliance
Industry Standards: The 1X1X.005CPLANESUBSTRATES complies with industry standards related to substrate materials, dimensions, and performance characteristics, ensuring its suitability for advanced electronic applications.
Identification
The designation 1X1X.005CPLANESUBSTRATES provides detailed information about the substrate's dimensions, material composition, and thin profile, enabling accurate identification and integration into sophisticated electronic systems and manufacturing processes.
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