Part #: 160-QFP-0.65M
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160-QFP-0.65M Component Specifications
General Information: The 160-QFP-0.65M component is a specialized part designed for use in electronic circuitry and microelectronic applications. Renowned for its compact size and high-density capabilities, this component offers precise functionality in advanced electronic systems.
Specifications
- Package Type: Quad Flat Package (QFP) with a pitch of 0.65mm, providing a space-efficient and reliable solution for integrated circuits and microcontrollers.
- Pin Count: Features 160 pins arranged in a grid pattern, allowing for efficient connectivity and signal transmission within electronic devices.
- Material: Constructed from heat-resistant materials to ensure stable performance under varying temperature conditions and thermal stress.
- Lead Finish: Utilizes a lead finish for soldering connections, enabling secure attachment to circuit boards and ensuring electrical conductivity.
Applications
- Electronic Devices: Ideal for use in consumer electronics, telecommunications equipment, and industrial control systems requiring high-speed data processing and compact design.
- Computing Systems: Suited for microprocessors, memory modules, and interface controllers in computers and servers demanding efficient data handling and processing capabilities.
- Automotive Electronics: Utilized in automotive control units, engine management systems, and safety modules for reliable and precise operation in vehicles.
Compliance
Industry Standards: The 160-QFP-0.65M component complies with industry standards for electronic components, ensuring compatibility, reliability, and performance in accordance with established guidelines.
Identification
The designation 160-QFP-0.65M signifies key attributes of the component, including its pin configuration, package type, and pitch size, facilitating accurate identification and integration into electronic designs and manufacturing processes.
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